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COG – Chip on Glass


An LCD driver chip mounted directly onto the display glass.

This method of packaging cuts the amount of layers on the PCB and therefore reduces the board complexity and size.COG reduces the overall system cost but requires close co-ordination between LCD design and IC module manufacturer.

Chip on glass technology reduces the number of LCD driver bonds from 5 in a concentional PCB (as show in figure (a), to a single bond as shown in figure (b)

Chip on Glass

Chip on glass packaging results in a much smaller display module.


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